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Applied Materials Extends Copper PVD Technology Leadership to 22nm Node Business Editors/Technology


(AP:SANTA CLARA, Calif.--) (BUSINESS WIRE) _ May 31, 2009-- Applied Materials, Inc. today launched its Applied Endura(R) CuBS RFX PVD system, the only copper barrier/seed deposition technology qualified for 32 and 22nm production by logic and flash memory manufacturers.

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